Michal Burchis Schwartz
S.C Laromet S.A, Romania
Biography
Michal Schwartz has completed her BA with cum laude, in materials engineering specializing in electronic materials and metals at Ben Gurion University in Israel. In 2003 graduated her MSc in electrical engineering (Physical Electronics) in the University of Tel Aviv in Israel. This year 2015 she will complete her PhD in materials engineering in the field of metallurgy at the Politehnica University of Bucharest, Romania. From 1996 she filled roles in engineering and High level management in the filed of nanotechnology at Intel (IDC), Tower Semiconductor and Zoran Cooperation. Michal Schwartz invented patents in communication and media in the United States. Recently she has published several papers in reputed journals in the field of metallurgy, extrusion and special metals. Today she is a consultant and give guides to enterprises in the field of metallurgy (castings, extrusion & drawing), and management in Europe, including Trip Materials Inc, Switzerland and S.C Laromet S.A, Romania
Abstract
Abstract : Failure of an Inconel 718 die used in production of hot copper direct extrusion
